| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To actualize electronic components with lead wires which reduce an absolute quantity of solder required for a soldering and are excellent in a mechanical strength, and a method of manufacturing the electronic components with the lead wires. <P>SOLUTION: A coating formation of a pair of terminal electrodes 3a, 3b is carried out to both ends of a component main body 2 formed in almost rectangular parallelepiped profile, and moreover lead wires 5a, 5b are connected with each end surface of the terminal electrodes 3a, 3b, respectively. In the electronic components with the lead wires, a part of the terminal electrodes 3a, 3b are covered with solders 6a, 6b so that a covering ratio of the solders 6a, 6b to the terminal electrodes 3a, 3b may become 30 to 80% in an area ratio. The electronic components with the lead wires are manufactured by a reflow heating treatment using cream solder. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
