| 摘要 |
PROBLEM TO BE SOLVED: To provide a coaxial type semiconductor laser module which can materialize an effective heat dissipation, and also can enhance an assembly character. SOLUTION: The coaxial type semiconductor laser module includes: a package in which a semiconductor light-emitting device is disposed on a stem; a base in which the package is internally disposed; an optical fiber which a light emitted from the package enters; a lens for linking the light emitted from the package with the optical fiber; and a cover for covering at least the lens and the optical fiber. The base has a through hole which has its upper part of a small diameter part and its lower part of a large diameter part, and of which a vertical cross-sectional shape changes, and in the package, the stem is located in the large diameter part, and also an upper face of the stem comes into contact with a boundary part where the vertical cross-sectional shape changes so as to conduct thermally. Further, the package has a fixing means for fixing the stem to the base, and the fixing means concerned connects a lower face of the stem to the base so as to conduct thermally through the fixing means. COPYRIGHT: (C)2009,JPO&INPIT
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