| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can excellently be bonded to another semiconductor device or a substrate and has excellent manufacture stability, and to provide the method of manufacturing the semiconductor device. <P>SOLUTION: The semiconductor device 1 has a semiconductor substrate 11 and a conductor post portion 121 projecting from the semiconductor substrate 11. The conductor post portion 121 is provided to the semiconductor substrate 11 without forming a hollow portion on an external surface from the tip to the base end on the side of the semiconductor substrate 11 in a direction crossing the projection direction of the conductor post portion 121. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
