| 摘要 |
A package structure for an inductance element is provided. The package structure comprises a casing, a plurality of conductive terminals, a lid, and a positioning device. The casing has two opposite first sidewalls and two opposite second sidewalls, all of which define a receiving space for receiving the inductance element. Each conductive terminal has an upper end and a lower end. The upper ends extend from an upper portion of one of the first sidewalls, and are located in a recess defined by the two opposite second sidewalls to electrically connect to the inductance element. The lower ends extend from a lower portion of the first sidewalls and are adapted to electrically connect to a circuit board. The lid is configured to cover the inductance element. The positioning device is disposed between the lid and at least one of the first sidewalls to position the lid onto the casing.
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