A TILLABLE SENSOR DEVICE

摘要

The present invention relates to a sensor device, comprising an integration substrate with a plurality of through-substrate vias, which have an electricallyconductive via core. Further, a sensor chip is provided, which has a first sensor-chip side that comprises at least one sensor and which is attached and electrically connected to the integration substrate on its first integration-substrate side. Also, a circuit chip, which is attached and electrically connected to the integration substrate on its second integration-substrate side comprises an integrated circuit, which is electrically connected with the sensors by means of at least one of the through-substrate vias. The sensor device forms a basis for a highly integrated, area- efficient large-area detector device that can be fabricated at low cost.