Cerium oxide abrasive and method of polishing substrates

摘要

A cerium oxide abrasive comprising a slurry, the slurry comprising slurry particles including cerium oxide particles having a value of structural parameter Y of from 0.01 to 0.70, the structural parameter Y representing an isotropic microstrain of said cerium oxide particles obtained by a powder X-ray Rietveld method with RIETAN-94; said cerium oxide particles being dispersed in a medium, wherein the slurry particles have a median diameter of from 150 nm to 600 nm, and primary particles having a median diameter of from 30 nm to 250 nm.