发明名称 Molding method and molding apparatus of mold product having thin film at inner surface
摘要 <p>A molding apparatus is configured by a first, a second sliding die, a first, a second fixed die, and a sliding film forming chamber. The first, the second sliding dies are moved in directions reverse to each other to take a primary molding position, a film forming position and a secondary molding position. The sliding film forming chamber includes a first, a second masking plate and are arranged to be remote from the first, the second fixed dies. Further, the sliding film forming chamber is slid in an up and down direction. The first, the second sliding dies are respectively formed with recess portions and cores, the first, the second fixed dies are respectively formed with cores and recess portions. </p>
申请公布号 EP1902826(A3) 申请公布日期 2008.12.03
申请号 EP20070018325 申请日期 2007.09.18
申请人 THE JAPAN STEEL WORKS, LTD. 发明人 NISHIDA, SHOSO
分类号 B29C45/00;B05D7/22;B29C37/00;B29C45/04 主分类号 B29C45/00
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