发明名称 ADJUSTING METHOD AND SUBSTRATE PROCESSING METHOD
摘要 When a host issues an analysis order that specifically instructs the analytical contents to an analytical apparatus (step 401), the analytical apparatus collects two types of measurement and/or inspection results from a measurement and/or inspection instrument (steps 403 to 409), and in step 411, the analytical apparatus analyzes the measurement and/or inspection results and optimizes processing conditions of a series of processes related to wafer W. In step 411, data related to a processing state of a processing apparatus is acquired from the processing apparatus as needed. In step 413, the measurement and/or inspection results and the optimization results are accumulated in a database, and the optimization results are transmitted to various processing apparatuses (including the measurement and/or inspection instrument). After that, the analytical apparatus sends a processing end notice to the host (step 417).
申请公布号 EP1998361(A1) 申请公布日期 2008.12.03
申请号 EP20070714345 申请日期 2007.02.16
申请人 NIKON CORPORATION 发明人 Okita, Shinichi
分类号 H01L21/027;G03F7/20;G03F9/00;H01L21/02;H01L21/66 主分类号 H01L21/027
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