发明名称 Mold clamping force measuring sensor
摘要 <p>The present invention provides a mold clamping force measuring sensor 1 in which a pair of square bar-like and semielliptical annulus-like sensor holders 2, 3 which hold a strain sensor 5 are connected by a hinge 4 to provide an elliptical annulus-like configuration as a whole which surrounds the outer circumference of a tie bar 50. On the hinged side, a first positioning tool 11 which includes an end block 12, a projection piece 15 for drop prevention that is projected from this end block 12, and is clamped and fixed by a clamping screw 10, and both-side face plates 17 which are fixed to both side faces of the end block 12, and are tightly contacted with both side faces of the sensor holders 2, 3 are provided. On the open side, a second positioning tool 21 which includes an end block 22, a circumferential direction misalignment prevention piece 24 which is faced to between the end faces of both sensor holders 2, 3, and is clamped and fixed by a clamping screw 10, and both-side face plates 26 which arc fixed to the side faces of the end block 22, and arc tightly contacted with both side faces of the sensor holders 2, 3 are provided.</p>
申请公布号 EP1997605(A2) 申请公布日期 2008.12.03
申请号 EP20080156715 申请日期 2008.05.22
申请人 SYSKO CORPORATION 发明人 SHIMODA, TOSHIO;SHIMODA, MASAMI;BEPPU, MASAHARU
分类号 B29C45/76;G01B5/30;G01B7/16;G01L5/00 主分类号 B29C45/76
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