发明名称 |
Inseparable PCB module in a sub body of a device |
摘要 |
Provided is an inseparable PCB module installed in a sub body of a device including a main body and the sub body performing predetermined opening and closing operations with respect to the main body. In the inseparable PCB module, a body part having a predetermined area, and a main body connecting part extending from the body part to a predetermined length and electrically connected to the main body are integrally formed, thereby reducing the entire volume and thickness of the device.
|
申请公布号 |
US7458833(B2) |
申请公布日期 |
2008.12.02 |
申请号 |
US20070704171 |
申请日期 |
2007.02.08 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD |
发明人 |
HA DONG-IN;KIM JAE-HO;YANG IN-CHULL |
分类号 |
H01R3/00;H04M1/00 |
主分类号 |
H01R3/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|