发明名称 BALL FORMATION APPARATUS AND METHOD FOR FORMING BALL USING THE SAME
摘要 The ball formation apparatus and the ball formation method using the same are provided to reduce the pitch between balls and the size of ball and to prevent the contact of adjacent balls in the reflow process. The plate(130) is for setting the objects in which ball pads are formed. The dotting tool(140) is for dotting a metal material for forming balls on ball pads. The aligned unit(120) is for arranging the objects and the dotting tool. The metal supplying unit(150) is filled with the metal material for forming balls and supplies the metal to the dotting tool. The dotting tool is moved to the plate and metal supplying unit. The dotting module(100) includes the dotting tool conveying unit for rising / dropping the dotting tool. The reflow unit(200) is for melting the preliminary ball dotted on the ball pad of the objects and for connecting the preliminary ball(20) to the ball pad in order to form balls on the objects. The objects conveying unit(190) transfers the objects to the plate and the aligned unit. The controller(230) controls the dotting module and the reflow unit.
申请公布号 KR100871387(B1) 申请公布日期 2008.12.02
申请号 KR20070078220 申请日期 2007.08.03
申请人 HYNIX SEMICONDUCTOR INC. 发明人 JUNG, YOUNG BERM
分类号 H01L21/60 主分类号 H01L21/60
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