发明名称 Semiconductor memory device and semiconductor integrated circuit
摘要 In a semiconductor memory device, third and fourth transistors are configured as a vertical structure. The third transistor is laminated over a first transistor, and the fourth transistor is laminated over a second transistor, whereby a reduction in cell area is achieved. A voltage, which is set on the condition that the difference between a source potential applied to each of the first and second transistors and the potential of a select level of a word line becomes greater than or equal to a threshold voltage of each of the third and fourth transistors, is supplied to a source electrode of each of the first and second transistors, to thereby perform "0" write compensation.
申请公布号 US7460392(B2) 申请公布日期 2008.12.02
申请号 US20070979128 申请日期 2007.10.31
申请人 RENESAS TECHNOLOGY CORPORATION 发明人 TAKAHASHI YASUHIKO;TANAKA TAKAYUKI
分类号 G11C11/00;G11C11/41;G11C11/412;H01L21/8244;H01L27/11;H01L27/12 主分类号 G11C11/00
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