| 摘要 |
A manufacturing method of a mother board for a high quality metal printed circuit board is provided to improve mass production of the mother board for the metal printed circuit board by using magnetron sputtering enabling high speed/high density deposition. A manufacturing method of a mother board for a metal printed circuit board using magnetron sputtering comprises sequentially performing a first step of preparing a substrate(100) formed of metallic materials including aluminum, copper and steel, a second step of forming an adhesive layer(200) on a surface of the substrate by using the magnetron sputtering, a third step of forming a first thin film(300) on a top face of the adhesive layer by using the magnetron sputtering, a fourth step of forming a second thin film(400) on a top face of the first thin film by using the magnetron sputtering, and a fifth step of repetitively laminating the first thin film and the second thin film.
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