SEALING RESIN COMPOSITION AND LCD

摘要

A sealing resin composition is provided to minimize the epoxy elution in procuring at 80~100 deg.C not to generate the liquid crystal contamination, and to ensure excellent adhesive force by absorbing the stress from the outside. A sealing resin composition comprises an epoxy resin, a potential thermosetting material, and non-crosslinked acryl-based polymer microparticles and acryl-based polymer microparticles having a core cell structure. The non-crosslinked acryl-based polymer microparticles have a softening point of 130 deg.C and an average particle diameter of 0.01-3 micrometer.