| 摘要 |
A semiconductor device is provided to suppress the insulating substrate and the heat radiator from being twisted. A semiconductor device comprises the first metal plate fixed on the insulating substrate, and the first side of the insulating substrate; the circuit board(11) including the second metal plate fixed on the second side of the insulating substrate; the semiconductor device(12) mounted on the first metal plate; the stress reduction element which has a round type corner and is fixed on the second metal plate; the heat sinking unit fixed on the stress reduction element. The stress reduction element is board-shape. |
