发明名称 DRY FILM RESIST PASTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a dry film resist pasting device capable of preventing bubbles from mixing between a substrate and a dry resist film as much as possible in pasting the dry film resist to the substrate, and immediately clearing the bubbles if the bubbles are mixed. SOLUTION: The dry film resist pasting device is provided with a case 10, a purging means for purging a gas in the case 10, a dry film resist supplying means 70 for supplying a dry film resist 50 to the inside of the case 10, a stage 30 provided in the case 10 to place a substrate 40, and a roller 20 for heating and pressing the dry film resist 50 supplied onto the substrate 40. In the device, the stage 30 or the roller 20 can move on a straight line in the same direction as that in supplying the dry film resist 50. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008288255(A) 申请公布日期 2008.11.27
申请号 JP20070129224 申请日期 2007.05.15
申请人 SHINKO ELECTRIC IND CO LTD 发明人 UCHIDA KENJI
分类号 H05K3/06 主分类号 H05K3/06
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