| 摘要 |
<p>A circuit board for heat dispersion includes a rectangle dielectric layer (10) and a plurality of pad groups (1, 2, 3) for soldering an electronic element. The pad groups (1, 2, 3) are laid on the front surface of the dielectric layer (10). Each pad group comprises a plurality of metal conductive pads (11, 12, 13), (21, 22, 23), (31, 32, 33) which are arranged at intervals. There is a first transverse insulating isolated area (6) between the two adjacent pads (11, 12), (12, 13), (21, 22), (22, 23), (31, 32), (32, 33). The width of the insulating isolated area (6) is less than the span between the positive terminal solder area and the negative terminal solder area of the electronic component. There are an anode soldering sheet (7) and a cathode soldering sheet (8) on the back surface of the dielectric layer (10). The anode soldering sheet (7) and cathode soldering sheet (8) spread on the back surface of the dielectric layer (10). There is a second insulating isolated area (9) between the anode soldering sheet (7) and the cathode soldering sheet (8). The first pad (11, 21, 31) and the last pad (13, 23, 33) of each pad group have vias (111, 131), (211, 231), (311, 331). The wall of the vias have conductive plating layer. The plating layer connects the pads to the anode soldering sheet (7) or the cathode soldering sheet (8).</p> |
