| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve cooling efficiency without causing a large scale of device. <P>SOLUTION: A heat transfer mechanism 30 is attached on a unit such as a memory 24 disposed in an internal space defined by an upper cover 11, a lower cover 12, a front panel 14 and a back panel 15. In this way, heat generated in the memory 24 can be efficiently transferred irrespective of the position of the memory 24 in a layout, and heat can be dissipated. Also, since the position of the memory 24 in the layout is not thermally restricted, the device can be miniaturized. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
