发明名称 SUBSTRATE PROCESSING APPARATUS AND TEMPERATURE CONTROLLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus of high energy efficiency excellent in temperature control accuracy of object of temperature control, and a temperature controlling device used for this substrate processing apparatus. SOLUTION: A part of a first flow passage 16 which circulates a first temperature controlling fluid 15 for controlling temperature of an object of temperature control passes trough a substrate processing part. A second temperature controlling fluid 18 which exchanges heat with the first temperature controlling fluid 15 flows a second flow passage 19. A circulation passage of the first temperature controlling fluid composed of an upper flow passage 16a, a part of the flow passage, a lower flow passage 16b and a bypass 366 is switched by a switching device to a circulation passage of the first temperature controlling fluid composed of the upper flow passage 16a, a part of flow passage, the lower flow passage 16b and a heat exchanging passage 39a. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008288615(A) 申请公布日期 2008.11.27
申请号 JP20080210074 申请日期 2008.08.18
申请人 TOKYO ELECTRON LTD 发明人 NOZAWA TOSHIHISA;KOTANI KOJI
分类号 H01L21/205;C23C16/46;H01L21/00;H01L21/3065 主分类号 H01L21/205
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