| 摘要 |
PROBLEM TO BE SOLVED: To provide a three-dimensional stacked device excellent in reliability and its manufacturing method, and a method of the junction of the three-dimensional stacked device. SOLUTION: A plurality of semiconductor wafers 2-5 are laminated to be integrated and thereafter, the integrated body is divided individually into respective devices to constitute the three-dimensional stacked device 1, and in this case, a junction of one semiconductor wafer is formed so as to have a projected shape 6 and a junction of the other semiconductor wafer is formed so as to have a recessed shape 7 while the projected junction 6 of one semiconductor wafer is directly connected to the recessed junction 7 for the other semiconductor wafer to constitute the stacked device. COPYRIGHT: (C)2009,JPO&INPIT
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