发明名称 COMPOUND WIREBONDING AND METHOD FOR MINIMIZING INTEGRATED CIRCUIT DAMAGE
摘要 A method is provided for creating a compound bond in a wire bonding process. The method includes forming a free air ball (804) at a first end (702) of a bonding wire (602). The method also includes determining a dimension and/or a shape of an anchored ball (406) disposed on a bonding site. The method further includes modifying a shape of the free air ball to at least partially conform to a shape of the anchored ball. This modification step also comprises modifying the shape of the free air ball in accordance with at least one of the dimension and the shape of the anchored ball. This modification step further comprises forming a concave surface (1502) on a portion of the free air ball. The method further includes bonding the free air ball to the anchored ball subsequent to modifying a shape of the free air ball.
申请公布号 US2008293235(A1) 申请公布日期 2008.11.27
申请号 US20070751849 申请日期 2007.05.22
申请人 HARRIS CORPORATION 发明人 DEJU HECTOR
分类号 H01L21/44 主分类号 H01L21/44
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