<p>A flat-shaped table electrode (13) is placed between a bump electrode (14) and an electrode pad (6) formed on a semiconductor chip surface. The table electrode (13) has a greater area than the tip end of the bump electrode (14), a thickness smaller than the height of the bump electrode (14), and a Young's modulus smaller than the bump electrode (14). When the semiconductor chip (3) is flip-chip mounted on a substrate (1), the bump electrode (14) is plastically deformed and the table electrode (13) is elastically deformed appropriately, thereby obtaining a preferable conductive state.</p>
