发明名称 Forming Mold Or Electroforming Mother Die Having Release Layer And Method For Manufacturing The Same
摘要 The present invention provides a forming mold or electroforming mother die comprising a mold or mother die, and a release layer composed of an organic thin film on a mold surface or mother die surface which is formed by contacting the mold or mother die with an organic solvent solution comprising a silane surfactant represented by the formula [1] <?in-line-formulae description="In-line Formulae" end="lead"?>Rn-Si-X4-n [1]<?in-line-formulae description="In-line Formulae" end="tail"?> (wherein, R represents an optionally substituted hydrocarbon group having 1 to 20 carbon atoms, an optionally substituted halogenated hydrocarbon group having 1 to 20 carbon atom, a hydrocarbon group having a linking group which has 1 to 20 carbon atoms, or a halogenated hydrocarbon group having a linking group which has 1 to 20 carbon atoms, and X represents a hydroxyl group, a halogen atom, an alkoxy group having 1 to 6 carbon atoms, or an acyloxy group, and n represents an integer of 1 to 3), and a catalyst capable of interacting with the silane surfactant, the release layer having excellent releasing properties and abrasion resistance, and a production method thereof.
申请公布号 US2008290249(A1) 申请公布日期 2008.11.27
申请号 US20050722847 申请日期 2005.12.28
申请人 NIPPON SODA CO., LTD. 发明人 HIDAKA TOMOYA;NAKAMOTO NORIFUMI;FUJITA YOSHITAKA
分类号 B28B7/34;B28B7/00 主分类号 B28B7/34
代理机构 代理人
主权项
地址