COMPONENT MOUNTING METHOD, COMPONENT MOUNTING APPARATUS, METHOD FOR DETERMINING MOUNTING CONDITIONS, AND APPARATUS AND PROGRAM FOR DETERMINING MOUNTING CONDITIONS

摘要

Provided is a component mounting method for mounting a component on a substrate. The component mounting method is applied to a component mounting apparatus which is provided with a mounting head for mounting the component on the substrate, and an inspecting head for inspecting the surface status of the substrate. The component mounting method includes a mounting step of repeatedly mounting the components onto prescribed substrates by the mounting head; a judging step of judging whether a component to be mounted is a prescribed component or not; and an inspection step of inspecting the surface status of the substrate by the inspecting head while the mounting step is being performed. In the inspection step, when the component to be mounted is judged as the prescribed component in the judging step, at least (i) loading status of the prescribed component is inspected after loading of the prescribed component is completed or (ii) mounting surface status relating to the prescribed component is inspected before starting loading of the prescribed component.