| 摘要 |
<P>PROBLEM TO BE SOLVED: To perform miniaturization in a high-performance system in a package with the need of complicated wiring. <P>SOLUTION: The semiconductor device including a plurality of semiconductor chips has a wiring board 1 provided with a first main surface S1 and a second main surface S2 positioned on the sides opposite to each other along the thickness direction and provided with first wiring W1 on the first main surface S1 and a plurality of electrodes 4 on the second main surface S2 respectively. Further, the semiconductor device has a first semiconductor chip 2 mounted on the first main surface S1 of the wiring board 1 and provided with a plurality of elements, and also a second semiconductor chip 8 incorporated in a region between the first main surface S1 and second main surface S2 of the wiring board 1 and provided with second wiring W2. Then, the plurality of elements provided in the first semiconductor chip 2 is conducted to a part or all of the plurality of electrodes 4 provided on the second main surface S2 of the wiring board 1 through the first wiring W1 provided on the first main surface S1 of the wiring board 1 and the second wiring W2 provided on the second semiconductor chip 8. <P>COPYRIGHT: (C)2009,JPO&INPIT |
