| 摘要 |
PROBLEM TO BE SOLVED: To enhance the reliability of a semiconductor device. SOLUTION: In the semiconductor device 1, metal foil 10b is boded to the lower surface of an insulating board 10a, at least one of metal foil 10c, 10d is bonded to the upper surface of the insulating board 10a, and at least one of semiconductor elements 20, 21 having a thickness of 50-100μm is bonded to the metal foil 10c, 10d through a solder layer 11a, 11b. When the semiconductor elements 20, 21 are bonded to the metal foil 10c, 10d through the solder layers 11a, 11b, soldering is performed to control displacement. Consequently, a semiconductor device exhibiting excellent reliability even after a long time use and its manufacturing process are obtained. COPYRIGHT: (C)2009,JPO&INPIT |
