| 摘要 |
An LED(Light Emitting Diode) package is provided to obtain a high optical output and to prevent a yellowing effect by using an excellent heat-radiating characteristic. An LED chip(41,43,45) emits light at a peak wavelength of 200nm to 350nm. A heat-radiating member is formed to radiate heat from the LED chip. A sealing member is formed of a silicon resin in order to seal the LED chip. The heat-radiating member has a characteristic for reflecting the light of the LED chip. The heat-radiating member is formed of a reflective material. The heat-radiating member includes a reflective layer. The reflective layer includes Al. The heat-radiating member includes a heat-sink supporting ring(13) having at least two connective terminals and a heat-sink inserted into the heat-sink supporting ring. The LED chip is arranged on the heat-sink. |
