SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME

摘要

A semiconductor package and the manufacturing method thereof are provided to improve the reliability and reduce the thickness of the semiconductor package by using the thin semiconductor device including the metal layer which covers the rear side. A semiconductor device(210) includes the first side including the bonding pad(122); the second side including the protruded parts(145) which are corresponded to bonding pads while being faced with the first side; the metal layer(150) which covers the second side while files up the protruded parts; the solder ball(155) provided on the bonding pads for the bump.