| 发明名称 |
Semiconductor device and method of manufacturing the same |
| 摘要 |
A semiconductor device of the present invention includes a chip which has a pad; a bump electrode formed on the pad; and a wire whose stitch bonding is made on the bump electrode. The wire satisfies a condition: (modulus-of-elasticity/breaking strength per unit area) >=400.
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| 申请公布号 |
US7456091(B2) |
申请公布日期 |
2008.11.25 |
| 申请号 |
US20060376090 |
申请日期 |
2006.03.16 |
| 申请人 |
RENESAS TECHNOLOGY CORP. |
发明人 |
KURAYA HIDETOSHI;ARAKAWA HIDEYUKI;AGA FUMIAKI |
| 分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
| 代理机构 |
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| 主权项 |
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