发明名称 ULTRA WIDE BAND HERMETIC SURFACE MOUNT TECHNOLOGY MICROWAVE MONOLITHIC INTEGRATED CIRCUIT PACKAGE
摘要 The discontinuity of the perpendicularity transition can be minimized by obtaining a small insertion loss and good junction using a trough line and slab line. The ultra-wide band hermetic sealing surface mount package for the integrated circuit comprises an integrated circuit(20); a plurality of first dielectrics(26) of multilayer, and the first line part which is mounted on the circuit board(21) and is electrically connected with the external circuit(15); a second line part(13,14) electrically connected with the first line part; the third line part which is electrically connected to the second railroad track part and is extended from the second railroad track part to the right; the bonding unit(19) which electrically connects the third railroad track part and the mounted integrated circuit; a plurality of second dielectrics which is formed in upper part of the package body and seals the integrated circuit hermetically, and is formed with multilayer; a package cover(11).
申请公布号 KR100870134(B1) 申请公布日期 2008.11.24
申请号 KR20070100305 申请日期 2007.10.05
申请人 ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE 发明人 JU, IN KWON;YOM, IN BOK
分类号 H01L23/12 主分类号 H01L23/12
代理机构 代理人
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