发明名称 |
METHOD OF INSPECTING MASK USING AERIAL IMAGE INSPECTION APPARATUS |
摘要 |
A method of precisely inspecting the entire surface of a mask at a high speed in consideration of optical effects of the mask. The method includes designing a target mask layout for a pattern to be formed on a wafer, and extracting an effective mask layout using an inspection image measured from the target mask layout using an aerial image inspection apparatus as a mask inspection apparatus. The effective mask layout is input to a wafer simulation tool for calculating a wafer image to be formed on the wafer. Optical effects of the mask are detected by comparing the target mask layout with the effective mask layout.
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申请公布号 |
US2008288912(A1) |
申请公布日期 |
2008.11.20 |
申请号 |
US20080122399 |
申请日期 |
2008.05.16 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM HEE-BOM;JI MIN-KYU;CHOI SUN-YOUNG;BAIK HYUN-JOO |
分类号 |
G06F17/50 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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