发明名称 |
HÄRTBARE SILIKONZUSAMMENSETZUNG UND ELEKTRONISCHE KOMPONENTEN |
摘要 |
A curable silicone composition comprising: (A) an organopolysiloxane that is represented by a specific average unit formula and that has at least two of the aforementioned epoxy-functional monovalent organic groups in each molecule; (B) a diorganosiloxane represented by the general formula: A-R5—(R42SiO)mR42Si—R5-A, wherein R4 is substituted or unsubstituted mono-valent hydrocarbon group that does not contain an aliphatically unsaturated bond, R5 is a divalent organic group, A is a siloxane residue with a specific average unit formula, and m is an integer with a value of at least 1; and (C) a curing agent for epoxy resin, exhibits excellent handling and curing characteristics and that cures to give a cured product that exhibits excellent flexibility and adhesiveness. |
申请公布号 |
DE602006003085(D1) |
申请公布日期 |
2008.11.20 |
申请号 |
DE20066003085T |
申请日期 |
2006.04.27 |
申请人 |
DOW CORNING TORAY CO. LTD. |
发明人 |
MORITA, YOSHITSUGU;ISSHIKI, MINORU;KATO, TOMOKO |
分类号 |
C08L83/06;C08L63/00;H01L23/29 |
主分类号 |
C08L83/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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