发明名称 INDUKTIONSSPULENANORDNUNG UND HERSTELLUNGSVERFAHREN DERSELBEN
摘要 A high current, low profile inductor (IHLP) includes a conductive coil molded within an inductor body substantially free from ferrite materials and comprising powdered iron materials. The method comprises pressure molding the inductor body substantially free from ferrite materials and comprising a powdered magnetic material within the hollow core of the coil and completely around the coil so that the magnetic material is substantially free from voids therein without shorting out the coil.
申请公布号 DE60040442(D1) 申请公布日期 2008.11.20
申请号 DE2000640442 申请日期 2000.03.15
申请人 VISHAY DALE ELECTRONICS INC. 发明人 SHAFER, TIMOTHY M.
分类号 H01F27/28;H01F37/00;H01F17/04;H01F27/29;H01F41/04 主分类号 H01F27/28
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