发明名称 |
FLEXIBLE SUBSTRATE SHEET, AND METHOD FOR ASSEMBLING CIRCUIT BOARD EMPLOYING THE SUBSTRATE SHEET |
摘要 |
PROBLEM TO BE SOLVED: To enhance mass productivity by improving continuity of work when a large number of circuit boards are assembled by connecting one component substrate to a counterpart circuit board. SOLUTION: A dummy substrate portion 20 and a component substrate 40 cut from the dummy substrate portion 20 by a discontinuous nick 30 are formed on a sheet base material 10 while being sectioned. The component substrate 40 is held temporarily by the dummy substrate portion 20 through a discontinuous portion 31 of the nick 30. The component substrates 40 are arranged at a plurality of positions of the sheet base material 10 in the same posture. One end of the component substrate 40 is used as a solder joint 41. The component substrate 40 can be discarded and separated from the dummy substrate portion 20 by tearing the discontinuous portion 31. All discontinuous portions 31 are located on one side of the solder joint 41. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2008282850(A) |
申请公布日期 |
2008.11.20 |
申请号 |
JP20070123255 |
申请日期 |
2007.05.08 |
申请人 |
FUNAI ELECTRIC CO LTD |
发明人 |
SOKAWA TERUAKI;MATSUOKA MASAYA |
分类号 |
H05K1/02;H05K3/36 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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