SYSTEMS AND METHODS FOR POST-CIRCUITIZATION ASSEMBLY

摘要

A method of making integrated circuit packages (290) using a conductive plate (205) as a substrate includes forming a partial circuit pattern on one side (220) of the conductive plate by stamping or selectively removing a portion of the conductive plate through part of its thickness, and then electrically coupling semiconductor dies (230) to the formed patterns on the conductive plate. The method further includes encapsulating at least a portion of the dies and the conductive plate with an encapsulant (240) and removing a portion of the conductive plate from the side (210) opposite the patterned side to form conductive traces based on the formed pattern. FIG. 8B