| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of joining an insulating substrate with a semiconductor element substantially in parallel without pressing the semiconductor element, and to provide a manufacturing method thereof. <P>SOLUTION: The semiconductor device 1 is the device where the semiconductor element 11 is mounted on the insulating substrate 13 via a solder layer 12. The contact region S of the insulating substrate 13 with the solder layer 12 is wider than the contact region P of the solder layer 12 with the semiconductor element 11. The solder layer 12 contains gold, and three or more balls 21 made of a base material with a melting point higher than that of the solder of the solder layer 12 are arranged inside the solder layer 12. Furthermore, it is preferable that the balls 21 have contact with not only the insulating substrate 13 but the semiconductor element 11. <P>COPYRIGHT: (C)2009,JPO&INPIT |
