| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor element mounting method which does not deteriorate the reliability of connection even when a bump for electric connection is miniaturized. <P>SOLUTION: The semiconductor element mounting method relates to connecting a panel (connection) electrode 18 formed on a substrate 12 to the bump 22 for electric connection provided on the semiconductor element 20 through an anisotropic conductive film 30. It comprises a process for providing a light shielding layer 40 having an opening 40a at a position opposed to the panel electrode 18 on an opposing surface 16b opposed to a mounting surface 16a, on which the semiconductor element 20 on the substrate 12 is mounted; a process for arranging the anisotropic conductive film 30 for covering the panel electrode 18 on the mounting surface 16a of the substrate 12; a process for disposing the semiconductor element 20 on the anisotropic conductive film 30; and a process for press-bonding the semiconductor element 20 to the substrate 12 through heating after melting conductive particles 30b in the anisotropic conductive film 30 pinched between the bump 22 and the panel electrode 18 by irradiating laser light L from the side of the opposing surface 16b. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
