| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce noise superimposed on an output signal of a semiconductor sensor chip arranged in the cavity of a housing. <P>SOLUTION: The semiconductor device 1 is constituted of the semiconductor sensor chip 5 provided in the housing 4 having the hollow cavity S and, in this case, the housing 4 is provided with a wiring unit 21a for grounding, a plurality of external terminals 25a, 33, 39 which are exposed to the outside of the housing 4 and a conductive shielding unit 8 for intercepting electromagnetic noise which tries to invade into the cavity S while the wiring unit 21a for grounding and the shielding unit 8 are electrically connected to the mutually different external terminals 25a, 33, 39. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
