发明名称 |
Flexible Circuit Substrate |
摘要 |
The present invention is directed to a substrate for subsequent eutectic bonding with a subsequently applied metal to provide, or as a precursor to the provision of, a circuit substrate. The circuit substrate comprises a dielectric film and a layer of an oxide or oxides of a metal on the film. The metal oxide layer has been formed by sputtering the metal of the metal oxide or oxides onto a surface of the film in the presence of an inert atmosphere save for at least one reactive gas content to provide the oxygen of the oxides.
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申请公布号 |
US2008283278(A1) |
申请公布日期 |
2008.11.20 |
申请号 |
US20060908741 |
申请日期 |
2006.04.04 |
申请人 |
WANG LI PING;WANG XIAO DONG;GAO JIAN XIA |
发明人 |
WANG LI PING;WANG XIAO DONG;GAO JIAN XIA |
分类号 |
H05K1/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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