| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated tape for a packing material in which a debonding-resistance voltage at re-bonding after heat seal is applied to a packaging base material is extremely suppressed not depending on a material of the packaging base material surface in the laminated tape for the packaging material used for package of a chip-like electronic part or the like. <P>SOLUTION: In the laminated tap for the packaging material, at least one layer of thermal adhesion layer is provided on a support base material layer, and in the laminated tape for the packaging material, the thermal adhesion layer includes a thermoplastic resin as a base polymer and includes an ionic liquid. As the ionic liquid, an alkali metal salt of an organic fluorine based anion can be preferably used. <P>COPYRIGHT: (C)2009,JPO&INPIT |
