| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a technology to achieve a highly flat surface for a semiconductor integrated circuit that uses copper as wiring metal. <P>SOLUTION: The present invention provides a polishing composition containing a neutralized carboxylic acid, an oxidizer and water, wherein a part of the carboxylic acid is an alicyclic resin acid (A) and the pH value is within a range of from 7.5 to 12. The alicyclic resin acid is preferably at least one type selected from the group consisting of abietic acid, an isomer of abietic acid, pimaric acid, an isomer of pimaric acid and derivatives of these, or a rosin. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
