| 摘要 |
<p>An electronic device (100) is characterized in that it comprises a wiring board (120) which is mounted with a semiconductor component (110) via bumps (115) and has a coefficient of thermal expansion different from that of the semiconductor component (110), a load reducing portion (130) which keeps the distance between the semiconductor component (110) and the wiring board (120) and reduces load applied to the bumps (115) of the semiconductor component (110), and a fixing portion (140) for fixing the load reducing portion (130), the semiconductor component (110), and the wiring board (120) to each other.</p> |
