| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board for mounting semiconductor devices, which can achieve high density mounting and fine wiring, corresponding to the increase in the number of terminals and the narrowing of a pitch of a semiconductor device, achieve the narrow pitch of an external electrode corresponding to the miniaturization and increased density of a system, and has improved mounting reliability. SOLUTION: The wiring board for mounting semiconductor devices comprises: an insulating layer 6 composed of a single layer; wiring 8 formed on the upper surface of the insulating layer; electrodes 5 each of which is formed at the lower surface side of the insulating layer so that at least the circumferential side of the upper end of the electrode is in contact with the insulating layer and at least the circumferential side of the lower end of the electrode is not in contact with the insulating layer while protruding its lower end from the lower surface of the insulating layer; vias 7 each of which is formed on the upper surface of the electrode in the insulating layer so as to conduct between the electrode and the wiring; and a supporting member 16 arranged on the surface of the insulating layer. COPYRIGHT: (C)2009,JPO&INPIT
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