发明名称 METHOD AND APPARATUS FOR GROWING PLASMA ATOMIC LAYER
摘要 An oxygen gas, for instance, is introduced into a film forming chamber, a plurality of monopole antennas arranged above a silicon substrate (101) inside the film forming chamber are supplied with high frequency power, plasma of the introduced oxygen gas is generated, and the surface of an aminosilane molecular layer (102) is supplied with atomic oxygen (123). Such plasma generation is performed for approximately one second. Thus, an adsorption layer (102) adsorbed on the surface of the silicon substrate (101) is oxidized, and a silicon oxide layer (112) of silicon of one atomic layer is formed on the surface of the silicon substrate (101).
申请公布号 KR20080100836(A) 申请公布日期 2008.11.19
申请号 KR20087023896 申请日期 2007.03.28
申请人 MITSUI ENGINEERING & SHIPBUILDING CO., LTD. 发明人 WASHIO KEISUKE;MURATA KAZUTOSHI;MIYATAKE NAOMASA;TACHIBANA HIROYOUKI;HATTORI NOZOMU
分类号 H01L21/31;H01L21/316;H01L21/318 主分类号 H01L21/31
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