SURFACE MOUNT TYPE ELECTRONIC COMPONENTS

摘要

Surface mount type electronic components can cause more little flux migration in the soldering on the surface of a substrate like a circuit board. Surface mount type electronic components is produced by molding a liquid-crystalline polymer composition containing 100 parts by weight of aromatic liquid crystal polymer having a melting temperature of 310-410deg.C and 5-100 parts by weight of glass fiber having the number average diameter of 4-8 micrometer and number average length of 100-200 micrometer. The LCP composition has the deformation temperature(DTUL) of 280-360deg.C. The electronic component comprises the aromatic liquid crystal polymer having repeating units of 4-oxybenzoyl and/or 6-oxy-naphthoyl. The total amount of repeating units of 4-oxybenzoyl and/or 6-oxy-naphthoyl is 50-80 mole % based on the total repeating units of the liquid crystal polymer.