METHOD FOR MONITORING SOLDER OF FBGA-TYPE FPGA ONTO PCB

摘要

The fine pitch BGA type and soldered contact of the printed circuit board can be conveniently determined by comparing the soldered contact state of the printed circuit board and FPGA with a test data. The method of inspecting the soldered joint state is provided. The step is for controlling to record the predetermined test data as the first FPGA among a plurality of FPGAs(21). The step is for and controlling to record data recorded in the first FPGA in the other FPGA except for the first FPGA among a plurality of FPGAs and comparing the test data with the data recorded in the other FPGA except for the first FPGA among a plurality of FPGAs. The step is for determining the soldered joint state of the printed circuit board and a plurality of FPGAs on the basis of the comparison result.