| 摘要 |
<p>The invention relates to a material, comprising: a metal matrix A, the material of which has a thermal expansion coefficient in the range of 16 to 20 ppm/K in at least one direction, formed from copper or a copper alloy and representing 10 to 75 vol. % of the material, at least one metal or ceramic filler B, with a thermal expansion coefficient in the range 4 to 6 ppm/K in at least one direction, formed from Cu<SUB>2</SUB>O and/or Al<SUB>2</SUB>O<SUB>3</SUB> and/or AlN and/or Mo and/or Cr and/or W and/or B and/or Ta, present in the material in an amount of 1 to 40 vol. % and a least one filler C based on carbon, characterised by a thermal expansion coefficient of - 2 to +2 ppm/K in at least one direction, having high thermal conductivity and being formed from graphite and/or carbon fibres and/or carbon nanofibres and/or carbon nanotubes and/or diamond and present in an amount of 5 to 65 vol. %.</p> |
