| 摘要 |
<p>The invention relates to a wafer-carrier arrangment comprising a wafer (1), a carrier layer system (5, 6) and a separation layer (4) which is arranged between the carrier layer system (5, 6) and the wafer (1). The carrier layer system (5, 6) comprises: i) a carrier layer (6) and ii) a layer made of a hardened, partially hardenend of hardenable elastomer material on the separating layer side, or comprises both layers. The separation layer (4) is: iii) a plasma polymer layer and iv) the adhesive strength between the carrier layer system (5, 6) and the separating layer (4), according to hardening of the elastomer material, is greater than the adhesive strength between the wafer (1) and the separating layer (4).</p> |
