SEMI-ADDITIVE PCB MANUFACTURING METHOD WITH EMPLOYING UV SENSITIVE POLYIMIDE LAMINATION

摘要

A method for manufacturing a semi-additive PCB adopting UV sensitive polyimide lamination reduces a hole processing cost by not using a laser drill process. An inner core substrate includes an upper layer copper circuit(20) and a lower layer copper circuit(30) in both sides interposing an insulating layer(10). A hole(160) for selective conduction is positioned between the upper layer copper circuit and the lower layer copper circuit. A sensitive polyimide layer(150) is laminated in both sides of the inner core substrate. A pattern is exposed and developed for the sensitive polyimide layer laminated in both sides of the inner core substrate. An interlayer hole is formed by selectively etching the sensitive polyimide layer according to a transferred pattern. An electroless chemical copper plating is performed on the selectively etched sensitive polyimide layer.