MOUNTING STRUCTURE OF ELECTRONIC PART TO DOUBLE-SIDED MOUNTING CIRCUIT SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING DOUBLE-SIDED MOUNTING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a mounting structure of electronic parts to a double-sided mounting circuit substrate wherein the high-density mounting of the electronic part is performed while improving a mounting intensity of the electronic part mounted to the double-sided mounting circuit substrate and improving mounting reliability, a semiconductor device equipped with the mounting structure, and a method of manufacturing the double-sided mounting semiconductor device. SOLUTION: The mounting structure of the electronic parts to the double-sided mounting circuit substrate is characterized in that: a primary electronic part 2 is mounted on the front surface of a circuit substrate 1; a secondary electronic part 3 is mounted on the rear face of the circuit substrate 1; and an electrode 9 of the primary electronic part 2 and an electrode 9 of the secondary electronic part 3 of at least one set which face each other at both sides of the circuit substrate 1 are connected by a conductive member 25 which is formed in one body in a via hole 5 formed at the circuit substrate 1. COPYRIGHT: (C)2009,JPO&INPIT